ball bonding

Development of high precision three-holder die set for bonding crystal ball

三模座高精度水晶粘球模架设计与制造

The gold stud bump of good coplanarity can be manufactured on condition that the ball bonding is good and the movement of capillary keeps consistent, and it validate the feasibility of finite element simulation of capillary shearing wire.

表明若能将金球较好地焊接到基板上面且劈刀运动的方位一致，就能制作出共面性一致的钉头金凸点，验证了劈刀剪切断丝有限元模拟的正确性。

Study on the Technology of High Density Gold wire Ball Bonding under Normal Temperature

高密度常温金丝球焊接技术探讨

In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical simulation.

本文采用数值模拟的方法研究了铜丝球键合技术中的形球过程。

Golden Ball Bonding ( GBB ) process is an important process for Head Gimbal Assembly ( HGA ) production .

金球焊接是生产 磁头臂 悬 架组件 的一道重要工序.

Numerical Simulation of the Ball Forming Process in Copper Ball Bonding

铜丝球焊中形球过程的数值模拟

Study on the Preparation and Ball Bonding Process for the High-Performance Copper Bonding Wire

高性能键合铜丝的制备及其球键合工艺研究

The Quality of Fine Pitch Ball Bonding: Influencing Factors& Solutions

高密度球键合质量的影响因素和解决方法

Fracture Analysis of Ball Bonding Gold Wire and the Way to Improve Processing Function

球焊金丝产生断裂的原因及改善加工性能的途径

Development of these work is of benefit to raising quality of gold wire ball bonding.

这些工作的开展有利于提高金丝球焊的焊接质量。

Contrast Research on the Reliability of Gold and Copper Wire/ Ball Bonding

金、铜丝球键合焊点的可靠性对比研究

From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.

研究结果表明，在没有保护气氛的环境下，单晶铜丝可以热超声球键合和楔键合在金衬底和铝衬底上。

The procedure of copper wire ball bonding and its reliability in power devices were investigated.

本文研究了功率器件中铜丝球键合工艺及可靠性。

Discussion of quality control of gold wire ball bonding

金丝球焊质量控制的探讨